For myself and my companies, in early 2005 I adopted the following version
of the "Precautionary Principle", which has worked very well for me for
the last four years:
Thus I have been very selective about buying any electrical or electronic stuff since year-end 2005. If I can find what I want as used, refurbished, or "new old stock" (NOS) on ebay or at a hamfest-- manufactured before 2006 (when the RoHS Directive went into effect)-- I feel comfortable just going ahead and buying it. If what I want is only available as new items, manufactured since the beginning of 2006, I do some hard thinking: Do I absolutely need this item for one of my businesses? Will it pay for itself within the first three months that I own it? Or do I just want the item? In many cases I'll say "Screw it. I'm not going to waste my money on lead-free crap". If I still really need the item, I will investigate various candidates based on the features/ functions/ etc. that are important to me, and sort the list by key factors to determine the desireability of each candidate. And if I discover that a candidate was designed or made in Europe, it automatically goes to the bottom of the list. Finally, I work down through the list, top-to-bottom, checking for availability, sources, and prices. Once I have found the three or so best candidates, I dig up all the information that I can find about them: specifications, datasheets, manuals, warranties, application notes, people's comments/ complaints about them, etc., to choose which one(s) I will buy.
For example, my girlfriend suggested that a "set top box" would make a nice birthday present for her, so that she can watch TV after the broadcast stations in Lexington go to all-digital TV in February 2009. We spent several months researching set top boxes, before I finally bought her one in July. With the $40 rebate coupon from the FCC, my total cost came to $25.32-- and I am still pissed off about having to waste even that much money on something that may only last a year, because of the RoHS Directive!
Maybe 1% of the documents that I have collected on these subjects say "Lead is bad. Remove it at any cost." (I've seen estimates that complying with the RoHS Directive will cost between $40,000,000,000 and $100,000,000,000 worldwide, and will cause 5 to 6 times as much environmental damage as if it had not been enacted.) About half of the documents say "here are ways that we can try to comply with the RoHS Directive and its clones, by investing huge amounts of engineering and manufacturing time, money, and management focus." But the gist of the rest of the documents that I have collected is:
Manufacturers of lead-free/ RoHS-compliant electronics-- and their lawyers-- may want to carefully study Article 7 in the European Product Liability Directive ( Directive 85/374/EEC + Directive 1999/34/EC) which offers this defense: "The producer shall not be liable as a result of this Directive if he proves... (d) that the defect is due to compliance of the product with mandatory regulations issued by the public authorities... "
The RoHS Directive has been in place for 3-1/2 years now, and so far I haven't read about any big fires, airplane crashes, or other major disasters that have been traced to lead-free electronics. Although, on Monday May 18, 2009, about 3,000 people had to evacuate the European Commission headquarters in Brussels, Belgium because a fire. Early reports said that the fire started in a "technical room", and was believed to be of accidental origin. (Wouldn't it be ironic if the cause was tin whiskers in a RoHS-Compliant computer, with poor fire resistance because of the RoHS Directive's ban on fire retardants in the plastic covers? We shall see....)
Technology Forecasters did a study in late 2007/early 2008 for the Consumer Electronics Association (CEA) on "Economic Impact of the European Union RoHS Directive on the Electronics Industry". Page 48 of this report, which came out January 21, 2008, said that in its first 1-1/2 years the RoHS Directive had cost the worldwide electronics industry $38.25 billion ($38,250,000,000), with an on-going cost of $3.7 billion ($3,700,000,000) per year! Microsoft, for example, had to take a $1 billion writedown to extend the warranty on the Xbox, because of numerous "Red Ring of Death" (RROD) failures caused by bad/unreliable lead-free solder joints.
Personally, since the RoHS Directive went into effect, I've restricted myself to buying maybe two or three pieces of new test equipment or computer stuff that costs more than $20 per unit per year. But I only do so if I expect the item to pay for itself within 3 months. I also treat all new electronics very tenderly, and try not to drop them onto any hard surfaces. If this new equipment is AC powered, I only plug it into a live outlet when I or someone else is around. If it is battery powered, I take out the batteries whenever the new electronic equipment is not in use. (These precautions play hell with clocks, by the way.) If the item costs less than $20, I'll probably buy three or more, to have a fighting chance that at least one unit will work when I need it.
Early in my study, I decided to pull this information together as a web page, to make it:
This bibliography now has:
If a reference can be downloaded from the Internet for free, I've included a link from its title to the appropriate web page. Some web sites require you to register online before accessing some of their documents. If a book, CDROM, paper, or report is in print, I show the list price and include a link to at least one source. Even if an item is out of print, you might be able to buy it from one of the sources listed on my web page Internet Sources for Electronics Books, Standards, Manuals, Journals, and Magazines.
My web page, Designing Lead-Free, RoHS-Compliant, and WEEE-Compliant Electronics, where I'm trying to summarize this huge mass of data, is already 55 pages long. And that is with only 4 out of 20 sections reasonably complete, the section on solder in process, and 15 sections barely blocked out... In that web page, "[xxx]" or "[xxx, pages yyy-zzz]" refers to a book or other document whose complete citation is in this bibliography. Like my books, both of these web pages are primarily aimed at electrical and electronic engineers who design and develop electronic products and electronic equipment for a living. We face more challenges than ever before:
This web page is divided into:
Government Regulations on Lead-Free, RoHS, and
WEEE (revised 2/11/2007)
[2] This Directive was amended by Directive 1999/34/EC in volume 42 issue L141 pages 20-21 of the OJ on June 4, 1999. The consolidated text of these two Directives is available on the EUR-Lex website. One defense that the producer (manufacturer, importer, or the person whose name or trade mark is on the product) can use is in Article 7: "The producer shall not be liable as a result of this Directive if he proves... (d) that the defect is due to compliance of the product with mandatory regulations issued by the public authorities... "
[3] Japan passed the Act on the Promotion of Effective Utilization of Resources Act No. 48 of 1991 (Japan "RoHS") in 2000.
[4] The European Union published the End of Life Vehicles Directive (ELV Directive, 2000/53/EC) in volume 43 issue L269 pages 34-42 of the Official Journal of the European Union (OJ) on October 21, 2000. This Directive took effect on July 1, 2002, and with some exceptions (Annex II), totally bans the use of (Article 4.2(a)):
[5] The European Union published the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Directive ( RoHS Directive, 2002/95/EC) in volume 46 issue L37 pages 19-23 of the OJ on February 13, 2003. This Directive takes effect on July 1, 2006, and with some exceptions (Annex) totally bans the use of (Article 4.1):
Article 2.3 explicitly states that spare parts for the repair of electrical and electronic equipment put on the market before July 1, 2006 do not fall under the RoHS Directive. Nor does the reuse of electrical and electronic equipment put on the market before July 1, 2006. I.e., the electrical equipment is already in the European Union, and out of the manufacturer's control as of July 1, 2006. Owners of equipment acquired before this date may repair or upgrade their equipment, to extend its lifetime, instead of being forced to discard it.
[6] Council Decision COM(2004) 606, adopted Sept. 23, 2004), amends the Annex of the RoHS Directive to permit-- in any application that was not already exempted--a homogenous material to contain a maximum of:
[8] The first amendment, which was published in volume 48 issue L214 page 65 of the OJ on August 19, 2005. Under this definition, we can have a multi-million dollar piece of equipment that we want to sell or use in the EU. But if so much as one mark on one component exceeds any of these limits, the entire piece of equipment violates the RoHS Directive... and our company may be severely punished for this transgression.
[9] Commission Decision 2005/717/EC, published Oct. 15, 2005, amends the Annex to the RoHS Directive. This became...
[10] The second amendment to the RoHS Directive was published in volume 48 issue L271 pages 48-50 of the OJ on October 15, 2005, revising exemption 9 in the Annex.
[11] Commission Decision 2005/747/EC, published Oct. 25, 2005, amends the Annex to the RoHS Directive. This became...
[12] The third amendment to the RoHS Directive was published in volume 48 issue L280 pages 18-19 of the OJ on October 25, 2005, revising exemptions 7 and 8, and adding exemptions 11-15 to the Annex.
[13] Commission Decision 2006/310/EC, published Apr. 26, 2006, amends the Annex of the RoHS Directive. This became...
[14] The fourth amendment to the RoHS Directive was published in volume 49 issue L115 pages 38-39 of the OJ on April 28, 2006, adding exemptions 16-20 to the Annex.
[15] Commission Decision 2006/691/EC, published Oct. 12, 2006, amends the Annex to the RoHS Directive. This became...
[16] The fifth amendment to the RoHS Directive was published in volume 49 issue L283 pages 48-49 of the OJ on October 14, 2006, adding exemptions 21-27 to the Annex.
[17] Commission Decision 2006/692/EC, published October 12, 2006, amends the Annex to the RoHS Directive. This became...
[18] The sixth amendment to the RoHS Directive was published in volume 49 issue L283 pages 50-51 of the OJ on October 14, 2006, adding exemption 28 to the Annex.
[19] Commission Decision 2006/690/EC, published Oct. 12, 2006, amends the Annex of the RoHS Directive. This became...
[20] The seventh amendment to the RoHS Directive was published in volume 49 issue L283 page 47 of the OJ on October 14, 2006, adding exemption 29 to the Annex.
[21] To help manufacturers, importers, and others understand their responsibilities, risks, and liabilities under European Directives, in 2000 the European Commission published the "Guide to the Implementation of Directives Based on New Approach and Global Approach". This is commonly called the "Blue Book", or "Blue Guide", and can help you understand just how European authorities will interpret these Directives when it is unclear whether/how a Directive applies to a specific product or situation.
[22] The DTI has published a draft of the United Kingdom's version of the RoHS Directive as "Part IV - The RoHS Directive - draft implementing Regulations."
[23] The official version of the UK law came out as Statutory Instrument 2006 No. 1463,
[24] The DTI has also published draft Guidance Notes for the RoHS Directive, dated July 2004.
[25] A revised draft RoHS REGULATIONS Government Guidance Notes came out in August 2005.
[26] The final RoHS REGULATIONS Government Guidance Notes came out in November 2005.
[27] The DTI published the RoHS Enforcement Guidance Document, Version 1 in May 2006.
[28] The European Union published the Waste Electrical and Electronic Equipment Directive (WEEE Directive, 2002/96/EC) in volume 46 issue L37 pages 24-38 of the OJ on February 13, 2003. Directive 2003/108/EC, published in volume 46 issue L345 pages 106-107 of the OJ on December 31, 2003, amends Article 9 of the WEEE Directive with regard to the financing of WEEE for businesses. The WEEE Directive:
.
[30] The DTI has also published draft Guidance Notes for the WEEE Directive, dated July 2004. According to these Guidance Notes, producers must register with the (UK) National Clearing House by August 13, 2005 (pages 4, 20-21).
[31] Commission Decision 2004/249/EC is a questionaire for Member States of the EU, on reporting the implementation of the WEEE Directive.
[32] Commision Decision 2005/369/EC on rules for Member States to monitor compliance with the WEEE Directive.
[33] The European Union also bans many flame retardants that might be used in printed circuit boards (PCB's) under the Restrictions on the Marketing and Use of Certain Dangerous Substances and Preparations Directive (Directive 76/769/EEC) which has been amended 39 times since it was published in the OJ in September 27, 1976.
[34] The European Union published the Batteries and Accumulators Containing Certain Dangerous Substances Directive (Battery Directive, 91/157/EEC) in volume xx issue L78 pages 38-41 of the OJ on March 26, 1991. Directive 98/101/EC, published in volume 42 issue L1 pages 1-2 of the OJ on January 5, 1999, clarifies the limitations on mercury in batteries. The Battery Directive permits lead-acid and nickel-cadmium batteries to be used in electrical and electronic equipment as long as they contain less than 0.0005% by weight of mercury. Button cells and batteries made from button cells are permitted to contain up to 2% mercury by weight (Article 3.1).
[35] The European Union published the Energy-using Products (EuP) Directive (EuP Directive, 2005/32/EC) in Volume 48 issue L191 pages 29-58 of the OJ on July 22, 2005. This Directive took effect on August 11, 2005. It sets up a framework for regulating products that:
[36] The European Union published a new Batteries and accumulators and waste batteries and accumulators (new Batteries Directive, 2006/66/EC) in volume 49 issue L266 pages 1-14 of the OJ on September 26, 2006. This Directive takes effect on September 26, 2009. Article 4 places limits on the mercury (Hg) and cadmium (Cd) content of batteries, but most of the Directive is concerned with collecting and recycling.
[37] China's Ministry of Information Industry has drafted a Management Methods for the Prevention and Control of Pollutants from Electronic Information Products law, often referred to as "China RoHS ". This law also bans:
[38] Grace Lin's web site has an unofficial translation of "Administrative Measure on the Control of Pollution Caused by Electronic Information Products," dated Mar. 2, 2006.
[39] China RoHS actually consists of several interconnected laws: "Measures for Administration of the Pollution Control of Electronic Information Products," May 9, 2006.
[39a] Another unofficial translation by the AeA is Management Methods for Controlling Pollution by Electronic Information Products."
[40] "Electronic Information Products Classification and Explanations," Mar. 16, 2006.
[41] "General Rule of Environment-Friendly Use Period of Electronic Information Products, Draft,"
[42] "Marking for Control of Pollution Caused by Electronic Information Products," Nov. 6, 2006.
[43] "Packaging Recycling Marks," Jan. 1, 2002.
[44] "Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products," Nov. 6, 2006.
[45] "Testing Methods for Regulated Substances in Electronic Information Products, Draft,"
[46] California passed Proposition 65, the Safe Drinking Water and Toxic Enforcement Act of 1986 in 1986. This act affects companies who:
[47] California adopted Senate Bill No. 20 (SB20) on September 25, 2003, banning the use of certain materials in some types of electronic equipment, and setting up a system for the collection and recycling of certain types of electronic waste.
[48] California adopted Senate Bill No. 50 (SB50) on September 29, 2003, amending SB20 in a number of areas, but the combination is usually still referred to as "SB20". SB20 and SB50 create a number of bureaucratic hurdles and snares for anyone who sells-- or wants to sell-- video display devices with screens larger than 4 inches diagonal (with some exceptions, SB50, pages 9, 11; SB20, page 9) to consumers in California:
[50] California Legal Council's digest of SB50, on page 2, (3) says "The act requires each manufacturer of an electronic device who sells a covered electronic device in this state to submit an annual report to the board on the number of electronic devices sold by the manufacturer". On page 6, 25214.10.1 specifies the information that a manufacturer must suppy to retailers and the State Board of Equalization. On page 9, 42463(f) defines the "covered electronic devices". On page 10, 42463(n) defines "manufacturer". On page 11, 42463(t) defines "video display device". On pages 11 and 12, 42464.6(a) gives the Department of Toxic Substances Control the authority to determine what is, or is not, a "covered electronic device". On pages 13 and 14, 42465.2 specifies the information that the manufacturer must supply to the California Integrated Waste Management Board, consumers, and the Department of Toxic Substances Control.
[51] For the actual implementation of SB20 and SB50, California's Health and Safety Code Section 25214.9-25214.10.2, under 25214.10(a) effectively bans lead, cadmium, mercury, and hexavalent chromium in "covered electronic devices" to the limits permitted by the RoHS Directive by January 1, 2007, or the effective date of the RoHS Directive, whichever comes later.
[52] Furthermore, California's Public Resources Code Section 42463, 42463(f) defines "covered electronic device", 42463(n) defines "manufacturer", and 42463(t) defines "video display device".
[53] California's actual regulations implementing SB20 and SB50 are in Emergency Regulations. 18660.5(23) has this snare for manufacturers-- "These catagories include, but are not limited to, (my italics) ...". 18660.41 specifies information that manufacturers must report to the California Integrated Waste Management Board, while 18660.42 specifies information that manufacturers must provide to consumers.
[54] Washington passed Engrossed Substitute House Bill 2488 (EGHB2488) on March 29, 2004 to establish a statewide recycling system for waste electronics.
[55] Maine adopted LD 743 (amended by HP 549) on May 14, 2003. This law bans disposal of CRT's in landfills after January 1, 2006.
[56] In late 2005/ early 2006 Maine adopted an electronic waste law under 38 MRSA Section 1610 to establish a statewide recycling system for waste electronics.
[57] Massachusetts, under 310 CMR 19 paragraph 19.017(3)(c), has not permitted cathode ray tubes (CRT's) to be deposited in landfills, or incinerated, since April 1, 2000.
[58] Minnesota adopted H.F. No. 882 in 2003. This law bans disposal of CRT's in landfills after July 1, 2005.
[59] Maryland adopted House Bill 575 on May 10, 2005. This law requires computer manufacturers that manufactured more than 1,000 computers per year, averaged over the last three years, to register with the (Maryland) Department of the Environment if they wish to sell new computers in the state after December 31, 2005. The initial registration fee is $5,000. The registration fee then drops to $500 per year if the manufacturer has implemented a "computer takeback program". Otherwise the registration fee continues at $5,000 per year. This law will expire December 31, 2010 unless it is renewed by the legislature.
Magazines/Newsletters on Lead-Free, RoHS, and WEEE
(revised 3/29/2005)
Electronics Manufacture and Test
Journal of Electronic Materials
LEAD-FREE Connection $195/year, published quarterly.
Soldering & Surface Mount Technology
Mailing Lists on Lead-Free, RoHS, and WEEE (revised
5/27/2009)
Leadfree mailing list for subscription; also see IPC LeadFree Archives
NoLeadTech mailing list for subscription; also see IPC NoLeadTech Archives
RoHS for subscription
Database for Solder Properties with Emphasis on New Lead-free Solders Release 4.0
Eco-Info & Lead (Pb)-Free: Lead (Pb)-Free Solutions from Texas Instruments
Electronics Manufacturing Productivity Facility
Infopool - On-line Information Resource about Lead-free Solders and Technologies
International Conference on Lead Free Electronics "Towards implementation of the RHS Directive"
International National Electronics Manufacturing Initiative (iNEMI)
Lead-free & RoHS Directive compliance services
Lead-Free Solder Testing for High Reliability (Project 1)
Lead-Free Solutions: Making Lead-Free a Reality Today
NASA-DOD Lead-Free Electronics (Project 2)
NASA Goddard Space Flight Center Tin Whisker (and Other Metal Whisker) Homepage
National Electronics Manufacturing Initiative (NEMI)
National Metal Finishing Resource Center
Printed Wiring Board Resource Center
RoHS Simplified (Department of Trade and Industry).
Speedline Technologies White Papers
Texas Instruments Quality & Pb-Free
Toxics Use Reduction Institute
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[] Earnshaw, A., and Greenwood, Norman, Chemistry of the Elements, 2nd Edition. Elsevier, 1997. List price $99.95.
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[] Yost, Frederick G., Hosking, F. Michael, and Frear, Darrel R., The Mechanics of Solder Alloy Wetting & Spreading. New York: Van Nostrand Reinhold, 1993. ISBN 0-442-01752-9. $215.00 list price.
Ph.D. and Master's Theses on Lead-Free, RoHS, and
WEEE (revised 8/29/2009)
Anastasio, Onofrio A., An Approach for Impression Creep of Lead-Free Microelectronic Solders . Master's Thesis for Naval Postgraduate School, Monterey, CA. June 2002. ASIN B0006S1AZU.
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Athavale, Saurabh N., A Comparison of Different Mechanical Testing Protocols on the Reliability of a Pb-free Solder System. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.
Athavale, Saurabh, Effect of Cu Concentration and Cooling Rate on Microstructure of Sn-3.9Ag-XCu. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.
Bai, Guofeng, Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection. Ph. D. Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, Oct. 2005.
Bangalore, Sudhindra Nagaraj, Evaluation of conductive adhesives for Surface Mount Technology. Master's Thesis for University of Louisville, Louisville, KY, June 1992.
Barry, Nathan, Lead-Free Solders for High-Reliability Applications: High-Cycle Fatigue Studies. Doctor of Engineering Thesis for University of Birmingham, Birmingham, United Kingdom, Oct. 23, 2008.
Beaumont, Matthew Hall, Characterization of Indalloy 227 Non Lead Solder. Ph. D. Thesis for Purdue University, West Lafayette, IN, Dec. 1999.
Becker, James Hall, Crystal Growth and Electrical and Optical Properties of Gray Tin. Ph. D. Thesis for Cornell University, June 1957.
Belbase, Hemant, Lead Free Soldering Materials, Reliability and Process Optimization . Master's Thesis for University of Massachusetts Lowell, Lowell, MA, Oct. 25, 2000.
Benedict, Michael Scott, Heterogeneous Nucleation of Sn in Sn-Ag-Cu Solder Joints. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Berrios, Antonio Tavarez, Modeling the Reflow Process of an Actual PCB. Master's Thesis for University of Puerto Rico, Mayaguez, PR, 2001.
Bhalerao, Vikram, Process Development and Reliability Study for 01005 Components in a Lead-Free Assembly Environment. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.
Bhardwaj, Divya, Development of Lead Free Thermal Fuse Wires Using Ohno Continuous Casting. Master's Thesis for University of Toronto, Toronto, Canada, 2008.
Bhave, Aniket, A Leaded and Lead-Free Solder Paste Evaluation Screening Procedure . Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.
Bloomer, Tamara Ellis, Microstructural and mechanical properties of a novel lead-free solder . Master's Thesis for Iowa State University, Ames, IA, 1999.
Bowers, Trevor S., Microstructural Evolution of Nickel-Enhanced Tin-Copper Solder Joints on Nickel/Gold and Immersion Silver PCB Finishes. Master's Thesis for University of Alabama in Huntsville, Huntville, AL, 2006.
Brenner, Sidney S., The Growth and Mechanical Properties of Metal Whiskers. Ph. D. Thesis for Rensselaer Polytechnic Institute, Troy, New York, May 1957.
Bruno, Felix, An Experimental Study on Voids in Area Array Devices for Mixed Alloy Assemblies. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.
Bukhari, Sarfaraz, Evaluation of the Effects of Processing Conditions on Shear Strength in Pb-Free Surface Mount Assembly. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2004.
Busta, Heinz, Uniaxial-tensile-stress-modified Galvanomagnetic Properties of Gray Tin . Ph. D. Thesis for Northwestern University, Evanston, IL, June 1974.
Chada, Srinivas, Effect of Processing Parameters and Thermal Cycling on the Microstructure and Strength of Eutectic Sn-Ag Solder on Cu. Ph. D. Thesis for Marquette University, Milwaukee, WI, May 1998.
Chandler, Gary Jesse Howard, Growth of Whiskers in the Indium-Tin Alloy System and the effect of Elastic Strain on Tc in alpha Indium-Tin. Master's Thesis for Clemson University, Clemson, SC, Aug. 1972.
Chang, Won, CSP Drop Test Performance Comparison for Different Solder Ball Materials . Master's Thesis for San Jose State University, San Jose, CA, May 2005.
Chaware, Raghunandan, Underfill Process Development for Lead Free Flip Chip Assembly. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2004.
Chennagiri, Gurudutt, Rework of Lead-Free Area Array Packages Assembled on Ultra-thin Flexible Substrates. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Chin, Melida, Electrical Contact Resistance of Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging. Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2005.
Choi, Sunglak, Studies on In-Situ Particulate Reinforced Sn-Ag Composite Solders Relevant to Thermomechanical Fatigue Issues. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2001.
Choi, Woojin, Reliability of Pb-free Solders in Electronic Packaging Technology . Ph. D. Thesis for University of California, Los Angeles, CA, 2002.
Choubey, Anupam, Microstructural Changes Under Isothermal Aging and Their Influence on Thermal Fatigue Reliability for Tin-Lead and Lead-Free Solder Joints, Including Microstructural Changes Under Isothermal Aging in Mixed Solder Joints. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.
Ciocci, Richard C., Assessing the Migration to Lead-Free Electronic Products. Ph. D. Thesis for University of Maryland, College Park, MD, 2001.
Collins, Andrew, Corrosion Inhibition for an Aluminum Substrate Bonded with an Electrically Conductive Adhesive. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2003.
Courey, Karim J., An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers. Ph. D. Thesis for University of Miami, Coral Gables, FL, May 2008.
Desrochers, Brigitte, Reliability of Soldered Joints for Aerospace Applications. Master's Thesis for Ryerson University, Toronto, Ontario, Canada, 2007.
Deubzer, Otmar, Explorative Study into the Sustainable Use and Substitution of Soldering Metals in Electronics: Ecological and Economical Consequences of the Ban of Leas in Electronics and Lessons to Be Learned for the Future. Graad van Doktor (Ph. D.) Thesis for Technische Universiteit Delft, Delft, Nederland, 2007.
Dhakal, Ramji, Failure Mechanism of Lead-Free Sn-Ag-Cu Solder BGA Interconnects. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2005.
Ding, Fei, Flip Chip and Lid Attachment Assembly Process Development. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 15, 2006.
Ding, Min, Investigation of Electromigration Reliability of Solder Joint in Flip-Chip Packages. Ph. D. Thesis for the University of Texas at Austin, Austin, TX, Aug. 2007.
Dong, Jaimee Ilene, The Effects of the Transition from Tin-lead to Lead-free Solder on Metal Flow in the United States. Ph. D. Thesis for Yale University, New Haven, CT, May 2008.
Edington, Joe Don, Development and Characterization of Cerium Oxide Coatings Deposited by Spontaneous Processes on Metallic Substrates. Ph. D. Thesis for University of Missouri - Rolla, Rolla, MS, 2004.
Ege, Efe Sinan, Thermo-mechanical Properties and Integrity of Metallic Interconnects in Microelectronics. Ph. D. Thesis for University of New Mexico, Albuquerque, NM, Dec. 2003.
Emery, Robert Thomas, Isotropic Conductive Adhesives for Use in the Microelectronics Industry . Master's Thesis for University of Toronto, Toronto, Canada, 1996.
Faizan, Mohammad, Experimental Study and Modeling of Metal Dissolution and Intermetallic Compound Growth During Soldering. Ph. D. Thesis for University of Akron, Akron, OH, Dec. 2007.
Fang, Tong, Tin Whisker Risk Assessment Studies. Ph. D. Thesis for University of Maryland, College Park, Maryland. 2005.
Fojas, Paul B., The Influence of Cold Work on the Wettability of Pb-Free Solders on Copper. Master's Thesis for San Jose State University, San Jose, CA, Dec. 2002.
Forest, Louis, Soudures Sans-Plomb Pour la Microelectronique. Master's Thesis for Ecole Polytechnique de Montreal, Montreal, Canada, Apr. 2008.
Fountoukidis, Evangelos, Thermo-Mechanical Response of Monolithic and NiTi Shape Memory Alloy Fiber Reinforced Sn-3.8Ag-0.7Cu Solder. Masters Thesis for Naval Postgraduate School, Monterey, CA. Sept. 2005.
Fukuda, Yuki, Experimental Investigations of Whisker Formation on Tin Platings . Ph. D. Thesis for University of Maryland, College Park, Maryland. 2005.
Gagliano, Robert Andrew, Characterization of the Growth Behavior of Cu-Sn Intermetallics in Liquid Tin/Solid Copper Reaction Couples. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 2002.
Gan, Hua, Polarity Effect of Electromigration on Intermetallic Compound (IMC) Formation in Pb-free Solder V-groove Samples. Ph. D. Thesis for University of California, Los Angeles, CA, 2004.
Ghorbani, Hamid Reza, Analytical Modeling of Thermal Stresses in Solder Joints - Application to Reliability Prediction. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2006.
Ghosh, Santaneel, A Non-contact Measurement Technique at the Micro Scale. Ph. D. Thesis for University of Arizona, Tucson, AZ, 2005.
Ghosh, Santanu, Finite Element Analysis of Moisture and Thermal Induced Stress in Flip Chip Packages. Master's Thesis for University of Texas at Arlington, Arlington, TX, May 2006.
Goland, Allen Nathan, Thermoelectric Properties of Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, Aug. 1956.
Goldstein, Julia L. Freer, Microstructural Development and Mechanical Behavior of Eutectic Bismuth-Tin and Eutectic Indium-Tin in Response to High Temperature Deformation (Lawrence Berkeley Laboratory Report LBL 34909). Ph. D. Thesis for University of California, Berkeley, CA, Nov. 1993.
Gopakumar, Sunil, An Experimental Approach to Develop Process Windows for Lead-Free Flip Chip Assembly from a Yield and Reliability Perspective. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2003.
Gordon, Matthew, A Nacreous Self-Assembled Nanolaminate for Corrosion Resistance on 2024-Al Alloy. Masters Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, May 24, 2001.
Gosavi, Mridula, Reliability Testing and Modeling of Linear Image Sensor Devices. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.
Greene, Christopher M., Lead-Free Solder Paste Printing for EMS Providers. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2001.
Greenlaw, Tamara, Cross-Functional Environmental Initiatives: Addressing Restriction of Hazardous Substance (RoHS) Technical Challenges at Sun Microsystems. Master's Thesis for Massachusetts Institute of Technology, Cambridge, MA, June 2005.
Groen, Luiken Jan, Kinetiek van de Allotrope Omzetting in Tin. Echeikundig Ingenieur Thesis, Delft, Netherlands, Oct. 31, 1956.
Guinane, James, Rework Methods for Stacked PCB SMT Assemblies. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.
Guo, Fu, Studies on Lead-Free Solders Reinforced with Mechanically-Incorporated Cu, Ag, and Ni Particles. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2002.
Guo, Weiqing, Testing Methodology for Reflow Soldering Process Compatibility Evaluation of Surface Mount Technology. Ph. D. Thesis for University of Texas at Austin, Austin, TX, May 2001.
Hamid, Mohd Foad Abdul, Thermomigration: An Experimental Damage Mechanics Study on Nanoelectronic Lead-Free Solder Alloys. Ph. D. Thesis for State University of New York at Buffalo, Buffalo, NY, May 2008.
Hanchinamani, V., Novel Additives for Conductive Epoxy Adhesive. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2001.
Haswell, Peter Lewis, Durability Assessment and Microstructural Observations of Selected Solder Alloys. Ph. D. Thesis for University of Maryland, College Park, MD, 2001.
Hensler, Donald Henry, Oscillatory Microwave Magnetoconductivity in Gray Tin. Ph. D. Thesis for University of Wisconsin, Madison, WI, Jan. 1963.
Hinkley Jr., Everett David, Oscillatory Magnetoresistance in Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1963.
Hodges, S. LeAnn, Evaluation of Lead Free Solder and No-Clean Flux for Attachment of High Power Components to Direct Bond Copper. Master's Thesis for University of Kentucky, Lexington, KY, 1996.
Hossain, Mohammad Masum, Development of Constitutive Equation Parameters and Reliability Evaluations of SnAgCu Interconnects. Ph. D. Thesis for University of Texas, Arlington, TX, May 2006.
How, Yew Seng, Modeling of Impression Testing to Obtain Mechanical Properties of Lead-Free Solders Microelectronic Interconnects. Masters Thesis for Naval Postgraduate School, Monterey, CA. Dec. 2005.
Huang, Xingjia, Investigation and Analysis on the Solder Ball Shear Strength of Plastic Ball Grid Array, Chip Scale, and Flip Chip Packages with Eutectic Pb-Sn and Pb-free Solders. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Jan. 2003.
Hwang, Tae-Kyung, Effects of microstructure on material behaviors and fatigue properties of lead-free solder materials. Ph. D. Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, Nov. 28, 2006.
Ibitayo, Oladimeji Olalekan, Evaluation of Various Die-Attachment Materials and Processes for Power Electronics Packaging. Master's Thesis for Howard University, Washington, D.C., Dec. 2008.
Islam, Mohd Nokibul, Investigations on Damage Mechanics and Life Prediction of Fine-Pitch Electronics in Harsh Environments. Ph. D. Thesis for Auburn University, Auburn, AL, Aug. 8, 2005.
Iyer, Ganesh R., Role of Intermetallics for Both Tin-Lead and Lead-Free Solder Structures and Its Solder Pad Combination. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.
Iyer, Satyanarayan Shivkumar, Assembly, Reliability, and Rework of Stacked CSP Components. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2008.
Jadhav, Susheel Ganeshrao, Stress Relaxation in Lead-Free Solder Joints. Master's Thesis for Michigan State University, East Lansing, MI, 2001.
Jafreen, Rifat, A Cost Model for Assessing the Transition to Lead-Free Electronics . Master's Thesis for University of Maryland, College Park, MD, 2008.
Jain, Sameer, Research and Application of a Thermal Management Device (CoolCap(TM)) for Electronic Assemblies. Master's Thesis for State University of New York, Binghamton, NY, 2006.
Jiang, Hongjin, Synthesis of Tin, Silver and Their Alloy Nanoparticles for Lead-Free Interconnect Applications. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Apr. 2008.
Johnson, Michael R., Evaluating Remanufacturing and Demanufacturing for Extended Producer Responsibility & Sustainable Product Management. Ph. D. Thesis for University of Windsor, Windsor, Ontario, Canada, Jan. 2002.
Joshi, Rahul V., Thermo-mechanical Behavior of Tin-Lead and Lead-Free Ceramic Column Grid Array Packages. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.
Kabade, Rajendra R., Metallurgical Investigation of Ag-Cu-Sn Lead-Free Solder with the Addition of Au. Master's Thesis for University of Texas at Arlington, Arlington, TX, Aug. 2003.
Kagwade, Sanjay Vasudeo, Surface Analytical and Electrochemical Studies of Aircraft Alloy Pretreatments and their Influence on Corrosion. Ph. D. Thesis for State University of New York, Stony Brook, NY, Dec. 1997.
Kao, Hui-Ju, Effect of Cu additives on Sn whisker formation and interfacial reaction of Sn(Cu) finishes. Master's Thesis for National Central University, Jhong-Li, Taiwan, May 23, 2005.
Katsis, Dimosthenis C., Thermal Characterization of Die-Attach Degradation in the Power MOSFET . Ph. D. Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, Jan. 16, 2003.
Kaushik, Muthur Srinath Purushotham, A Statistically Based Evaluation of Creep and Shear Behaviour of Monolithic and Composite Lead Free Solders for Microelectronic Applications . Master's Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2004,
Keimasi, Mohammadreza, Flex Cracking and Temperature-Humidity-Bias Effects on Reliability of Multilayer Ceramic Capacitors. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.
Kim, Dong Hyun, Reliability Study of SnPb and SnAg Solder Joints in PBGA Packages . Ph. D. Thesis for The University of Texas at Austin, Austin, TX, Dec. 2007.
Kim, Dongwook, Fluxless Flip Chip Bonding Processes and Aerial Fluxless Bonding Technology. Ph. D. Thesis for University of California, Irvine, CA, 2004.
Kim, Harqkyun, Wetting Kinetics and Interfacial Reaction of Lead(Pb)-based and lead(Pb)-free Solder Alloys on Cu and Ni Metallizations in Electronic Packaging. Ph. D. Thesis for University of California, Los Angeles, CA, 1996.
Kim, Hye-Rim, Growth and Low Frequency Noise Properties of Grey Tin Films. Ph. D. Thesis for Cornell University, Ithaca, NY, May 1991.
Kim, Jongsung, Fluxless Bonding Technology Using Electroplated Multilayer Solder Structures. Ph. D. Thesis for University of California, Irvine, CA, 2007.
Kim, Patrick Gu-Ho, Wetting Behaviors and Interfacial Reactions of Pb-containing and Pb-free Solder Alloys on Au, Pd, Ni Foils, Leadframes, and Under Bump Thin Film Metallizations in Electronic Packaging. Ph. D. Thesis for University of California, Los Angeles, CA, 1998.
Kindesjo, Ulrika, Phasing out lead in solders: An assessment of possible impacts of material substitution in electronic solders on the recycling of printed circuit boards. Master's Thesis for University of Lund, Lund, Sweden, Oct. 2002.
Kinyanjui, Robert Kamau, Thermal Processes and Solidification Kinetics of Evolution of the Microstructure of Sn-xAg-yCu (0 <=x<=4.0; 0<=y<=1.4) Solder Alloys. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.
Kirkpatrick, Timothy, The Kinetics of Tin Solidification in Lead-Free Solder Joints. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.
Ladani, Leila Jannesari, Damage Initiation and Evolution in Voided and Unvoided Lead Free Solder Joints Under Cyclic Thermo-mechanical Loading. Ph. D. Thesis for University of Maryland, College Park, MD, 2006.
Lavine, Charles Frederic, Two-band Galvanomagnetic Effects in Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1968.
Lee, Jong-Gi, Investigation of Thermomechanical Fatigue (TMF) Behavior in Tin-Silver Based Solder Joints. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2005.
Lee, Kyuoh, Development of Thermo-Mechanically Reliable Lead-Free Solder Alloys . Ph. D. Thesis for University of California, Berkeley, CA, Fall 2007.
Lee, Taekyeong, Electromigration and Solid State Aging of Flip Chip Solder Joints and Analysis of Sn Whisker on Lead-frame. Ph. D. Thesis for University of California, Los Angeles, CA, 2001.
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Li, Haiying, Study of Thermally Reworkable Epoxy Materials and Thermal Conductivity Enhancement Using Carbon Fiber for Electronics Packaging. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Nov. 2003.
Li, Jing, Evaluation and Improvement of the Robustness of a PCB Pad in a Lead-Free Environment. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
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Lin, Dechao, Development of Lead-Free Solders Reinforced by Nanoparticles. Ph. D. Thesis for Southern Methodist University, Dallas, TX, May 20, 2006.
Lin, Xuan, An Environmentally Compliant Cerium-Based Conversion Coating for Aluminum Protection. Ph. D. Thesis for University of Missouri - Rolla, Rola, MO, 1998.
Li, Yi, High Performance Electrically Conductive Adhesives (ECAs) for Leadfree Interconnects. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Dec. 2007.
Lindquist, Rolf Eugene, The Infrared Optical Properties of Single-crystal Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1963.
Linteau, Mark W., Impression Creep in Near Eutectic Tin-Lead and Tin-Silver Solders . Master's Thesis for University of Texas at Arlington, Arlington, TX, May 1997.
Liu, Pilin, Roles of Interfacial Reaction on Mechanical Properties of Solder Interfaces. Ph. D. Thesis for University of Illinois at Urbana-Champaign, Urbana, IL, 2004.
Liu, Yueli, Lead-Free Assembly and Reliability of Chip Scale Packages and 01005 Components. Ph. D. Thesis for Auburn University, Auburn, AL, May 11, 2006.
Lohokare, Saurabh, A Novel Conductive-Polymer-Based Integration Process for High-Performance Flip-Chip Packages. Ph. D. Thesis for University of Delaware, Newark, DE, Summer 2004.
Loomans, Michael Eugene, Phase Equilibria in Potential Pb-Free Solder Alloy Systems. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 1999.
Lu, Daoqiang, Fundamental Understanding of Electrically Conductive Adhesives (ECA's) . Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, July 2000.
Lu, Yuan, Effect of Ag and Cu on Sn-x%Ag-y%Cu Interconnects. Ph. D. Thesis for Wayne State University, Detroit, MI, 2006.
Ma, Hongtao, Characterization of Lead-Free Solders for Electronic Packaging. Ph. D. Thesis for Auburn University, Auburn, AL, 2007.
Matin, Md. Abdul, Microstructure evolution and thermomechanical fatigue of solder materials. Ph. D. Thesis for Technische Universiteit Eindhoven, Eindhoven, Netherlands, Nov. 16, 2005.
Mavoori, Hareesh, Mechanical Properties and Fatigue Lifetime Prediction of Solders for Electronic Applications: Tin-Silver and Tin-Zinc Eutectics. Ph. D. Thesis for Northwestern University, Evanston, IL, 1996.
McCabe, Rodney James, Creep of InSb and SbSn Strengthened Tin-based Alloys: Effect of Precipitate Size, Shape, and Spacing. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 2000.
McDougall, Jeffrey Lee, An Analysis of Global and Localized Creep Strains and Creep Properties of Non-Composite and Composite Lead-Free Solders at Room and Elevated Temperatures. Master's Thesis for Michigan State University, East Lansing, MI, 1998.
Mei, Yuhai, Stress Evolution in a Conductive Adhesive during Curing and Cooling . Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2000.
Mirza, Fahad, Investigation of the Impact Response of Lead-Free Electronic Assemblies and Comparison of Drop with Cyclic 4-point Bend Test. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Morose, Gregory J., Electronics Assembly, Rework, and Reliability Evaluation Using Lead-Free Soldering Materials, Halogen-Free Laminate Materials, and Surface Finishes with Nanomaterials. Sc. D. Thesis for University of Massachusetts Lowell, Lowell, MA, 2008.
Morris, Eric Leon, Use of Cerium-Based Inhibitors in Electrochemically Deposited Coatings for the Corrosion Protection of Aluminum Alloys. Ph. D. Thesis for University of Missouri - Rolla, Rolla, MO, 2000.
Mudge Jr., Wilbur L., Kinetics of the alpha to/from beta Transformation of Pure Tin. Master's Thesis for University of Pennsylvania, Philadelphia, PA, June 1949.
Mukherjee, Shantanu, Lead-Free Wave Soldering of 'Thick' PCB Using Sn 3.8%Ag 0.07%Cu and No-Clean VOC-Free Flux. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Munukutla, Aravind, Tensile Properties of Lead Free Solders. Master's Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2004.
Nagarkar, Kaustubh Ravindra, A Systems Approach to Ultra-fine Pitch Flip Chip Interconnect Packaging . Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.
Nambiar, Sudeep, Process Development of 01005 Assembly. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Neuder, Heather Aurelia, In-Situ Phosphatizing Coatings for Aerospace, OEM and Coil Coating Applications. Ph. D. Thesis for Northern Illinois University, DeKalb, IL, Dec. 2003.
Panchagade, Dhananjay R., Damage Prediction of Lead Free Ball Grid Array Packages Under Shock and Drop Environment. Ph. D. Thesis for Auburn University, Auburn, AL, May 10, 2007.
Park, Tae-Sang, A Study on Mechanical Fatigue Behaviors of Ball Grid Array Solder Joints for Electronic Packaging. Ph. D. Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, May 30, 2004.
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Pei, Min, Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a SnAg Alloy. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, May 2007.
Pierce, David Michael, Continuum Damage Mechanics Based Failure Prediction Methodology for 95.5Sn-3.9Ag-0.6Cu Solder Alloy Interconnects in Electronic Packaging. Ph. D. Thesis for Stanford University, Stanford, CA, June 2007.
Plaza, Gustavo Alberto, Impact of Board Pad Finish on the SnPb and Lead-free Solder Interconnect Reliability for Leadless Chip Resistors under Random Vibration Loading. Master's Thesis for University of Maryland, College Park, MD, 2008.
Puthenparambil, Abhilash, Effect of Bonding Pressure on Reliability of Anisotropic Conductive Adhesives Joints in a Silicon-to-Flex-Substrate Interconnection. Master's Thesis for Binghamton University, State University of New York, Binghamton, NY, 2006.
Qi, Yan, Accelerated Thermal Fatigue of SnPb and Pb-Free Solder Joints: Effect of Temperature Range and Rate of Change. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2005.
Quintero, Pedro O., Development of a Shifting Melting Point Ag-In Paste Via Transient Liquid Phase Sintering for High Temperature Environments. Ph. D. Thesis for University of Maryland, College Park, MD, 2008.
Rajagopal, Subramanian, Transition of Low-Volume Complex Electronic System Industries to Lead-Free Electronics. Master's Thesis for University of Maryland, College Park, 2003.
Ramkumar, S. Manian, Process Analysis and Performance Characterization of a Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Assembly. Ph. D. Thesis for Binghamton University, State University of New York, Binghamton, NY, 2007.
Raut, Rahul, Thermal Management of Heat Sensitive Components in Pb-Free Assembly and Rework Process. Master's Thesis for State University of New York, Binghamton, NY, 2005.
Ready IV, William Judson, Reliability Investigation of Printed Wiring Boards Processed with Water Soluble Flux Constituents. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, July 2000.
Reinbold, Lucine Kabakian, Kinetics of Interfacial Reaction and Stress Evolution in Bimetallic Copper-Tin Thin Films. Ph. D. Thesis for Brown University, Providence, RI, May 2007.
Ren, Fei, Polarity Effect of Electromigration on Mechanical Properties of Lead-Free Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2006.
Reuse, Rolando, Thermomechanical Behavior of Monolithic Sn-Ag-Cu Solder and Copper Fiber Reinforced Solders. Masters Thesis for Naval Postgraduate School, Monterey, CA. Sept. 2005.
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Rodekohr, Chad L., Material Factors Influencing Metallic Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 19, 2008.
Rogers, Keith Leslie, An Analytical and Experimental Investigation of Filament Formation in Glass/Epoxy Composites. Ph. D. Thesis for University of Maryland, College Park, Maryland. 2005.
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Rowley, Jonathan Gabriel, The Role of Soldering Process Variables on Properties of Lead-Free Solder Joints. Master's Thesis for University of Texas at Arlington, Arlington, TX, Aug. 2003.
Sabbagh, N. A. J., Tin Whisker Growth in the Communication Industry. Master's Thesis for Sir George Williams University, Montreal, Canada, Apr. 1973.
Sajjala, Sandeep Reddy, Optimizing Stencil and Pad Design for 0201 Components in a Lead-Free Assembly. Master's Thesis for State University of New York, Binghamton, NY, 2006.
Sanapala, Ravikumar, Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-Free Soldering Conditions. Master's Thesis for University of Maryland, College Park, MD, Aug. 2008.
Sane, Shantanu Madhavrao, Disturbed State Concept Based Constitutive Modeling for Reliability Analysis of Lead Free Solders in Electronic Packaging and for Prediction of Glacial Motion. Ph. D. Thesis for University of Arizona, Tucson, AZ, 2007.
Sani-Bakhtiari, Paymon, Surface Mount DC/DC Converter Attachment to Printed Circuit Board . Master's Thesis for University of Toronto, Toronto, Canada, 2002.
Sattiraju, Seshagirirao V., Wetting Studies of Pb-Free Solders on Pb-Free PWB Finishes. Ph. D. Thesis for Auburn University, Auburn, AL, Aug. 5, 2002.
Seddon, Michael John, Characterization and Comparison of Creep Properties for Tin-Indium-Silver Solder Joints. Master's Thesis for University of Arizona, Tucson, AZ, 1996.
Selvaraj, Mukesh K., An Experimental Study of Electromigration in Flip Chip Packages. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Sengupta, Shirsho, Effects of Solder-Dipping as a Termination Re-finishing Technique . Masters Thesis for University of Maryland, College Park, Maryland. June 2006.
Shah, Vatsal, Pb-Free Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Solder Preforms. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2005.
Sidhu, Rajen Singh, Thermomechanical Behavior of Sn-Rich (Pb-Free) Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, Aug. 2007.
So, William W., Fluxless Indium and Silver-Indium Bonding Processes for Photonics and High Temperature Electronics. Ph. D. Thesis for University of California, Irvine, CA, 1999.
Song, Fubin, Experimental Investigation on Testing Conditions of Solder Ball Shear and Pull Tests and the Correlation with Board Level Mechanical Drop Test . Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Aug. 2007.
Song, Ho Geon, Microstructural Evolution of Eutectic Au-Sn Solder Joints (Lawrence Berkeley National Laboratory Report LBNL50573). Ph. D. Thesis for University of California, Berkeley, CA, May 2002.
Song, Yubao, Study of Pulse Plating and Reaction Mechanism of Trivalent Chromium Deposition Process. Ph. D. Thesis for Clarkson University, Potsdam, NY, Apr. 20, 2000.
Stark, Brian H., Thin Film Technologies for Hermetic and Vacuum Packaging of MEMS. Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2004.
Stinson-Bagby, Kelly, Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints. Master's Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, June 7, 2002.
Stromswold, Eric Ivan, Characterization of eutectic tin-silver solder joints. Ph. D. Thesis for University of Rochester, Rochester, NY, 1993.
Su, Bin, Electrical, Thermomechanical and Reliability Modeling of Electrically Conductive Adhesives. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, May 2006.
Su, Peng, A Study on the Reliability of Flip Chip Solder Joints. Ph. D. Thesis for Cornell University, Ithaca, NY, Jan. 2001.
Subbaiyan, Sudharsan, A Physical Model Examination of Micro-brazing Reaction with Gallium and Copper. Master's Thesis for Queen's University, Kingston, Ontario, Canada, Apr. 2005.
Subbarayan, Guhan, A Systematic Approach for Selection of Best Pb-Free Printed Circuit Board (PCB) Surface Finish. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Suh, Jongook, Orientation distribution, morphology, and size distribution of Cu6Sn5 intermetallic compound in reactions between molten solder and Cu in flip chip solder joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2006.
Tan, Wei, Development of Convective Reflow-Projection Moire Warpage Measurement System and Prediction of Solder Bump Reliability on Board Assemblies Affected by Warpage. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Apr. 2008.
Tang, Zhenming, Interfacial Reliability of Pb-Free Flip-Chip BGA Package. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.
Telang, Adwait U., Characterization of Deformation in Sn-Ag Lead-Free Solders During Thermomechanical Fatigue Using Orientation Imaging Microscopy. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2004.
Telang, Adwait U., Characterization of Microstructural Evolution of Crept, Aged and Thermomechanically Fatigued Eutectic Sn-Ag Solder Joints using Orientation Imaging Microscopy. Master's Thesis for Michigan State University, East Lansing, MI, 2002.
Theeven, J. G. A., Creep and Failure of Lead-Free Solder Alloys. Master's Thesis for Eindhoven University of Technology, Eindhoven, Netherlands, Mar. 2002.
Tonapi, Sandeep Shrikant, Assembly and Reliability of Lead-Free Flip Chips. Ph. D. Thesis for State University of New York, Binghamton, NY, 2001.
Tunga, Krishna Rajaram, Study of Sn-Ag-Cu Alloy Reliability Through Material Microstructure Evolution and Laser Moire Interferometry. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Aug. 2008.
Varghese, Joseph, Effect of Dynamic Flexural Loading on the Durability and Failure Site of Solder Inteconnects of Printed Wiring Assemblies. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.
Vishwanathan, Krishnan, Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Lead Free Solder Preforms. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Vollweiler, Fred O, P., Intermetallic Growth at the Interface between Copper and Bismuth-Tin Solder. Masters Thesis for Naval Postgraduate School, Monterey, CA. Sept. 1993.
Wagner, Robert John, Free Carrier Reflectivity of Gray Tin Single Crystals. Ph. D. Thesis for Northwestern University, Evanston, IL, Aug. 1967.
Wang, Daijiao, Experimental Study of Void Formation in Solder Joints of Flip-Chip Assemblies. Ph. D. Thesis for University of Texas at Austin, Austin, TX, May 2005.
Wang, Qing, Mechanical Properties and Microstructure Investigation of Sn-Ag-Cu Lead Free Solder for Electronic Package Applications. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 16, 2005.
Wei, Yong, Electronically Conductive Adhesives: Conduction Mechanisms, Mechanical Behavior and Durability. Ph. D. Thesis for Clarkson University, Potsdam, NY, Apr. 1995.
Welch III, Warren Cornelius, Vacuum and Hermetic Packaging of MEMS Using Solder. Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2008.
Wolfson, Robert George, Transformation Studies of Gray - Tin Single Crystals. Master's Thesis for Northwestern University, Evanston, IL, June 1960.
Wong, Anthony Yin-Bong, Implementation and Qualification of a Prototype Tester for Reflow Soldering Process Compatibility Evaluation of Surface Mount Technology Components. Ph. D. Thesis for University of Texas at Austin, Austin, TX, Dec. 2002.
Wright, William L., Processing of NiTi Reinforced Adaptive Solder for Electronic Packaging . Masters Thesis for Naval Postgraduate School, Monterey, CA. Mar. 2004.
Wu, Ji, Electrical Characterization and Reliability Assessment of Lead-Free Solder Coated Electrical Contacts. Ph. D. Thesis for University of Maryland, College Park, MD, 2003.
Xiao, Qiang, Constitutive Model Development for Lead Free Solder Alloys at Multiple Specimen Scales. Ph. D. Thesis for University of Wyoming, Laramie, WY, Dec. 2004.
Xing, Yan, Study of Thermal and Chemical Factors Which Influence Solidification of Tin in Near Eutectic Sn-3.0Ag-XCu Lead Free Solder. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.
Xu, Shuangyan, Evaluating Thermal and Mechanical Properties of Electrically Conductive Adhesives for Electronic Applications. Ph. D. Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, Apr. 2001.
Yang, Fan-Yi Ou, Electromigration and Thermomigration in Pb-free SnAgCu and Eutectic SnPb Flip Chip Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2007.
Yang, Hong, Mechanical and Thermomechanical Stability Issues of 96.5SN-3.5AG Solder Joints in Microelectronic Packages. Ph. D. Thesis for North Carolina State University, Raleigh, NC, 1998
Yang, Quan, Modeling and Characterization for Small-Scale Packaging Applications . Ph. D. Thesis for State University of New York, Binghamton, NY, 2004.
Yang, Se-Young, Reliability Evaluation for Flip-Chip Electronic packaging Using Optical Measurement Techniques. Ph. D. Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, Nov. 29, 2004.
Yang, Wenge, Process-Structure-Property Relationship for Eutectic Sn-Ag Solder Joints . Ph. D. Thesis for Rensselaer Polytechnic Institute, Troy, NY, Aug. 1995.
Yao, Yao, Modeling the Mechanical Properties of Intermetallic/Solder Interfaces . Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 2008.
Ye, Hua, Mechanical Behavior of Microelectronics and Power Electronics Solder Joints Under High Current Density: Analytical Modeling and Experimental Investigation. Ph. D. Thesis for State University of New York, Buffalo, NY, June 1, 2004.
Yoon, Ji-Young, A Research for the Moisture-Induced Properties of ACF Package Materials . Master's Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, Dec. 27, 2006.
Young, Poh-shien, Measurements of Electrical Conductivity of Filaments of Gray Tin and Gray Tin Alloys. Master's Thesis for Oklahoma Agricultural and Mechanical College (now Oklahoma State University), Stillwater, OK, May 1957.
Yu, Hao, Combined Thermal, Thermodynamic and Kinetic Modelling for the Reliability of High-Density Lead-Free Solder Interconnections. Doctor of Science in Technology Thesis for Helsinki University of Technology, Espoo, Finland, 2006.
Zahedi, Fahad, Reliability of Lead-Free Solder Under Cyclic Bending. Master's Thesis for University of Texas at Arlington, Arlington, TX, May 2006.
Zbrzezny, Adam R., Characterization and Modeling of Microstructural Evolution of Near-Eutectic Sn-Ag-Cu Solder Joints. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2004.
Zhan, Yumei, Micro Zero-Insertion-Force (ZIF) Connector for Multi-Substrate Packages . Ph. D. Thesis for Michigan Technological University, Houghton, MI, Dec. 2003.
Zhang, Qian, Isothermal Mechanical and Thermomechanical Durability Characterization of Selected Pb-Free Solders. Ph. D. Thesis for University of Maryland, College Park, Maryland. 2004.
Zhang, Zhongqin, Nucleation and Growth Kinetics of Tin and Tin-Silver Alloy During Initial Stages of Electrodeposition. Ph. D. Thesis for University of New Hampshire, Durham, NH, Dec. 2004.
Zhao, Ping, Creep Corrosion over Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-plated Leadframes. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.
Zheng, Yunqi, Effect of Surface Finishes and Intermetallics on the Reliability of SnAgCu Interconnects. Ph. D. Thesis for University of Maryland, College Park, Maryland. 2005.
Zhou, Jianguo, Processing of Generic Circuits by Conductive Adhesives: Geometrical and Rheological Considerations. Ph. D. Thesis for University of Akron, Akron, OH, May 2007.
Zhou, Xiaoying, Life Cycle Thinking and Assessment Tools on Environmentally-Benign Electronics: Convergent Optimization of Materials Use, End-of-Life Strategy and Environmental Policies. Ph. D. Thesis for University of California, Davis, CA, 2007.
Zribi, Anis, Kinetics of Intermetallic Growth at the Interfaces of Soldered Metallizations. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2002.
A Guide To Lead-Free Soldering for Assemblers & Sub-Contractors, Version 2.6, $68 from Roger Bilham Consultancy
AIM Lead-Free Information, Version 4.1, from AIM.
Assembly Technology Expo Sept. 26-28, 2006, from Nihon Superior.
e3 survival toolkit, 499 British pounds + value-added tax from eco3 (do not have)
EMC & Compliance Yearbook Plus Information Bank 2005.
Guide to Lead-Free Wave Soldering, 99 British pounds + value-added tax from Soldertec Global (do not have)
Handsoldering and De-soldering with Lead-Free Solder, 99 British pounds + value-added tax from Soldertec Global (do not have)
Lead-Free Assembly and Soldering Cook Book3, $195 from Electronics.CA Publications (do not have)
Lead-Free: Fantasy or Fact?, $75.00 from MEPTEC (do not have)
Lead-Free Hand Soldering & DeSoldering Interactive CD-ROM, $195.00 from electronics.ca publications (do not have)
Lead-Free Solder CD-ROM, $570 for NCMS members, $670 for non-members from National Center for Manufacturing Sciences (do not have)
Lead-Free Solder Implementation Summit, $75.00 from MEPTEC (do not have)
Lead-Free Soldering Interactive Cook Book 3, $195.00 from electronics.ca publications
Lead-Free Watch: Countdown to July 1, 2006.
MacDermid's Patented Immersion Silver Solderability Preservative
Reflow Soldering with Lead-Free Solder Paste, 99 British pounds + value-added tax from Soldertec Global (do not have)
RoHS Ready Lead-Free Solutions, from Kester.
Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of Tin, Silver and Copper, $99.00 for members and $199.00 for non-members from IPC
SMART Group Lead-Free Seminar 1999 & 2000 Slides, $50.00 for members and $60.00 for non-members from SMTA
SMTA TechScan Compendium: The State-of-the-Art in Pb-free Soldering Technology, $85.00 for members and $105.00 for non-members from SMTA
SN100C Lead-Free Alloy, Version 1.3, from AIM.
Summit on Lead-Free Solder Implementation, $75.00 from MEPTEC (do not have)
Papers, Reports, and Magazine Articles on Lead-Free,
RoHS, and WEEE (revised 12/30/2009)
"0201 capacitors creating process problem," Circuitnet, Sept. 25, 2006.
"100% Sn Plating Whisker Growth Study," AMD, Jan 10, 2003.
"12-month shelf life for chemical silver," evertiq, Nov. 11, 2005.
"1st Meeting of RoHS Enforcement Bodies Network."
"2004 - 10/01/2004 - OSHA Proposes Revised Rule on Hexavalent Chromium," Occupational Safety & Health Administration, Oct. 1, 2004.
"2006 (2nd) TMS State of Art Pb-free Technology Workshop Panel Discussion Summary," 2006 Lead-Free Technology Workshop, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.
"2006: The Year of RoHS," Manufacturing.net, June 21, 2006.
"2008 Review of Directive 2002/96/EC on waste electrical and electronic equipment (WEEE),"
"2009 Industry Forecast," Surface Mount Technology (SMT), vol. 22 no. 12, pp. 8,11-17,19-20,22-23, Dec. 2008.
"3M provides information on the new OSHA hexavalent chromium standard," Welding Design and Fabrication, vol. 79 no. 5, pp, 6-7, May 2006.
"7 more RoHS exemptions proposed," evertiq, June 6, 2008.
"A big answer to a WEEE problem," Department of Trade and Industry, July 25, 2006.
"A Brief History of Lead," EDN, vol. 47 no. 9, pp. 57, Apr. 18, 2002.
"A Citizen's Guide to Producer Responsibility," Feb. 2003.
"A Flood of New Environmental Laws," SourceESB, July 13, 2006.
"A legal look at environmental compliance," SourceESB, Mar. 22, 2006.
"A New Standard for Tin-Nickel I. S. O. 2179: International Standard for Electroplated Coatings of Tin-nickel Alloy," Tin and its Uses, no. 94, pp. 7, 1972.
"A practical precaution against introducing zinc whiskers," finishing.com.
"A quiet introduction for the RoHS Directive?," Components in Electronics, vol. xx no. xx, pp. xx-xx, Aug. 2006.
"A Research Program on SAC Lead Free Alloys," IPC Solder Products Value Council.
"A Review of California and Maine's electronics recycling programs," INFORM, Dec. 2006.
"A round-table discussion examining issues around the forthcoming European Restrictions of Hazardous Substances (RoHS) and electrical waste (WEEE) directives," Electronics Weekly, Feb. 11, 2004.
"A Study of Lead-Free Wave Soldering,", AIM.
"A WEEE bit late," Electronics Manufacture and Test, pp. xx-xx, Mar. 2006.
"A WEEE Warning," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Sept. 19, 2007.
"A Year of Many Conversions!," Lead-Free Connection, vol. 4 no. 1, pp. 1, Feb. 2007.
"A320's electrical system falters," evertiq, Aug. 11, 2008.
"About RoHS enforcement," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.
"Achieving a Competitive Advantage Through RoHS Compliance," PCB007 , July 28, 2005.
"ACI Lead Free Manufacturing for Navy Systems," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.
"Actel goes green on 100% of its FPGA products," SourceESB, Dec. 15, 2004.
"Action to take on WEEE and RoHS," Electronics Weekly, Dec. 10, 2004.
"Adaption to scientific and technical progress under Directive 2002/95/EC," Oko-Institut e.V., 2007.
"Additional Revisions to the RoHS Directive = A Bumpy Ride for IPC Members," IPC Review, vol. 2 no. 2, pp. 8, Mar./Apr. 2009.
"Additional RoHS Exemptions Sought," Circuits Assembly, vol. 16 no. 3, pp. 8, Oct. 2005.
"Advanced AP Maine Touts Recycling Computer Monitors," Appliance Design, vol. xx no. x, pp. xx-xx, Jan. 2006.
"Advantages and Disadvantages of AOI Methodologies in Lead-Free PCB Assembly," AOI Solutions.
"Advantages of vapour phase reflow for lead-free soldering," Dataweek, Oct. 1, 2008.
"Africa Discusses E-waste at COP8," SMT Web Exclusive Article.
"After RoHS Deadline - Glut or Shortages?," SourceESB, Nov. 16, 2006.
"Agere discovers lead-free packaging method," Advanced Packaging , vol. xx no. xx, pp. xx-xx, Sept. 21, 2004.
"Agere Systems Uncovers Method to Overcome Barriers to Global Lead-Free Chip Implementation," Agere Systems, Sept. 20, 2004.
"Agere's Lead-free (Pb-free) Plating Capabilities Matte tin (Sn) versus matte Sn-over-nickel (Ni) underplate," Agere, Sept. 2004.
"Ageus now offers China RoHS compliance services," EE Times - Asia , vol. xx no. xx, pp. xx-xx, Apr. 4, 2006.
"Ageus Solutions: A Leader in UK WEEE Support," PCB007, Jan. 5, 2007.
"Ageus Solutions Launches New China RoHS Services," PCB007, Mar. 31, 2006.
"Ageus Solutions Provides China RoHS Services to Electronics Industry," PCB007, Oct. 24, 2006.
"AIM Lead-Free Validation Program," AIM.
"Alarming Facts About RoHS Compliance," Printed Circuit Design and Manufacture, vol. 23 no. 9, pp. 10, Sept. 2006.
"All Aboard -- Next Stop is Lead-Free Electronics," Lead-Free Connection, vol. 1 no. 1, pp. 1, July 2004.
"Allotropic Transformation of Tin," Tin and its Uses, no. 161, pp. 3, 1989.
"Allotropy," Advanced Materials & Processes, vol. 167 no. 2, pp. 81, Feb. 2009.
"Alloy Selection Team: Alloy Database," Mar. 16, 2000.
"Alloy Temperature Chart," Kester, July 19, 2002.
"Alloys that we've selected."
"Alternatives," Transactions of the Institute of Metal Finishing, vol. 75 no. 1, pp. B3-B4, Jan. 1997.
"Alternatives to Cadmium Plating: Reflections Five Years Later," Plating and Surface Finishing, vol. 69 no. 11, pp. 34-43, Nov. 1982.
"An Assessment of the Use of Lead in Electronics Assembly: Part 1," Circuit World, vol. 19 no. 2, pp. 18-24, 1993.
"An Assessment of the Use of Lead in Electronics Assembly: Part 2," Circuit World, vol. 19 no. 3, pp. 25-31, 1993.
"An Inherent Advantage of Tin-Nickel Coatings: Compressive State Reduces Corrosion," Tin and its Uses, no. 55, pp. 2-3, 1962.
"An Interview with the Editor of a new book, "Lead-Free Solder Interconnect Reliability"," Circuitnet, Jan. 30, 2006.
"An Introduction to Lead-Free Soldering," AIM.
"An Update: Elimination of Lead from Electronics," Boeing Environmental Technotes, vol. 7 no. 4, pp. 1-4, Nov. 2002.
"Analyzing lead-free soldering defects in wave soldering using Taguchi methods," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 23, 2005.
"Analyzing Thermal Fatigue," Circuits Assembly, vol. 18 no. 1, pp. 52-53, Jan. 2007.
"Announcement of "Guidelines for the Management of Chemical Substances in Products"," Japan Green Procurement Survey Standardization Initiative (JGPSSI), Sept. 27, 2005.
"Another Candidate Wave Solder."
"Another satellite to replace wayward pager relay," CNN Interactive, May 20, 1998.
"Anti-Counterfeiting Trade Agreement Negotiations Urged to Start," Circuitnet, Mar. 6, 2008.
"Apathy over legislation could damage electronics industry," European Electronics Engineer, vol. xx no. xx, pp. xx-xx, Nov. 11, 2003.
"Application for an additional exemption from RoHS for Fine Pitch Flexible Applications."
"Application of Fritsch Laboratory Mills for WEEE and RoHS Tests," Aufbereitungs-Technik/Mineral Processing, vol. 47 no. 6, pp. 48, June 2006.
"Applications of Tin-Nickel Alloy Electroplate," Tin and its Uses , no. 78, pp. 5-6, 1968.
"Are Counterfeit Parts Going Compliant?," SourceESB, Jan. 11, 2006.
"Are electronics companies on target for lead-free RoHS deadlines?," Circuit World, vol. 31 no. 3, pp. xx, 2005.
"Are equipment companies mandated to meet lead-free requirements?," Circuitnet, Apr. 24, 2006.
"Are the military and telecommunications industries off the hook on RoHS?," SourceESB, Jan. 26, 2005.
"Are You Ready for RoHS?," EDN, July 21, 2005.
"Are You Ready for RoHS?," ECN Supplement, pp. 1, Nov. 2005.
"Are You Ready for RoHS Compliance?," Review, vol. 45 no. 9, pp.
2-5, Nov. 2004.
"Are you ready to collect & recycle WEEE in Germany from 23 March?,"
evertiq, Mar. 17, 2006.
"Are your parts the real deal?," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, June 9, 2008.
"Are Zinc Whiskers Growing in Your Computer Room?"
"Arrow adds green data," Purchasing, vol. xx no. xx, pp.
xx-xx, Aug. 4, 2005.
"Arrow Electronics Delivering Critical Environmental Data On More Than 2.3
Million Components," Arrow Electronics, June 29, 2004.
"Arrow Electronics Enables OEMs to Check RoHS Compliancy at No Cost through
ArrowNAC.com," PCB007, Apr. 20, 2006.
"Arrow Electronics Offers Critical Environmental Data for Customers,"
PCB007, July 13, 2005.
"Arrow Helps Get the Lead Out."
"Arrow releases WEEE-guide," evertiq, Aug. 2, 2005.
"Artesyn's Approach to RoHS Compliance," Artesyn, Sept. 14-15, 2005.
"As RoHS Deadline Looms, Universal Compliance in Doubt," Supply &
Demand Chain Executive, vol. xx no. x, pp. xx-xx, xxxx.
"Asian firms on track to meet RoHS rules," emsnow, July 11,
2006.
"Ask Dr RoHS: problems with lead-free BGA solder balls," Electronics
Weekly, Apr. 20, 2006.
"Ask the Expert," Medical Product Manufacturing News, vol. xx
no. xx, pp. xx-xx, 2006.
"ASK the Experts," TUV Rheinland World News, pp. 2,
Mar./Apr. 2005.
"ASK the Experts," TUV Rheinland World News, pp. 8,
Sept./Oct. 2005.
"Assemblers to Suppliers: Which Lead-free Alloy?," Surface Mount
Technology (SMT), vol. 14 no. 2, pp. xx-xx, Feb. 2000.
"Assemblies Go PoP," Circuits Assembly, vol. 18 no. 12, pp.
34-35, Dec. 2007.
"Assembling High-Lead (Pb) DS2502 Flip-Chips in a Pb-Free Assembly Flow,"
EE Times - Asia, vol. xx no. xx, pp. xx-xx, June 8, 2005.
"Assembling High-Lead (Pb) DS2761 Flip-Chips in a Pb-Free Assembly Flow,"
Maxim Application Note 3599, Sept. 16, 2005.
"Assembly Guidelines: Sterling Silver & MacStan Immersion Tin Coated
PCB's," HKPCA Journal, no. 12, pp. 1-7.
"Assembly Lines: Japan Leads in Lead-Free," Assembly, vol. xx
no. xx, pp. xx-xx, Oct. 2004.
"Assessing Life-Cycle Impacts," EPA, May 2002.
"Assessment of Responses to the Third Consultation Documents: WEEE and RoHS
Directives," DTI, Nov. 2004.
"ASTM Declarable Substances Committee Publishes New REACH Standard,"
CircuiTree, vol. 21 no. 6, pp. xx-xx, June 2008.
"ASTM Establishes Committee on "Declarable Substances"," Conformity
, vol. 10 no. 11, pp. 50, Nov. 2005.
"ASTM Establishes Committee on "Declarable Substances"," Conformity
, pp. 214, Conformity 2006: The Annual Guide.
"At Deadline," Waste News, vol. xx no. x, pp. xx-xx, Feb. 27,
2006.
"At the Sharp, (Toshiba and Panasonic) end of US recycling,"
Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan. 7,
2008.
"Autocatalytic Deposition of Tin," Tin and its Uses, no. 128, pp.
10-11, 1981.
"Avnet offers RoHS compliance data," Purchasing, vol. xx no.
xx, pp. xx-xx, Nov. 4, 2004.
"Back Up Block 1 Whisker on Cu," June 6, 2003.
"Back Up Block 2 Whisker on NiFe," June 6, 2003.
"Back Up Block 3 Solderability," June 6, 2003.
"Baking lead-free and lead PCB's before assembly," Circuitnet
, Feb. 4, 2007.
"Ban Lifted on Deca-BDE Flame Ratardants," Printed Circuit Design and
Fab, vol. 25 no. 7, pp. 8, July 2008.
"Ban on Lead May Accelerate Component Obsolescence Problems,"
Lead-free Electronics, Nov. 2004.
"Banish Black Pad and Other PCB Laminate Issues," Circuitnet,
Sept. 9, 2008.
"Baroque Magnificence in Tin An Austrian Shrine," Tin and its Uses
, no. 43, pp. 1-7, Summer 1958.
"Base Material Selection Tool," Polyclad.
"Basel e-Waste Conference Convenes," Surface Mount Technology Online Article,
June 23, 2008.
"Basler Power Supplies," Westinghouse Nuclear Tech Bulletin TB-02-5, July
12, 2002.
"Battling Corrosion - and Making it Green," Products Finishing
, vol. 73 no. 9, pp. 8, June 2009.
"BCF says that REACH is good for UK coatings industry." Finishing
, vol. 30 no. 1, pp. 4, Jan.-Feb. 2006.
"Best, Inc. Lead-Free Roadmap," Best, June 6, 2005.
"Better than Chrome?," Products Finishing, vol. 73 no. 11, pp.
8-9, Aug. 2009.
"BFR Restrictions in Many US States to Follow EU's RoHS," Conformity
, vol. 10 no. 9, pp. 53-54, Sept. 2005.
"BFR Restrictions in Many U.S. States Expected to Follow EU's RoHS,"
Conformity, pp. 214, Conformity 2006: The Annual Guide.
"BGA re-balled with lead free spheres," Circuitnet, June 4,
2006.
"BGA Replacement limit," Circuitnet, Jan. 26, 2009.
"BGA Rework - with or without solder paste," Circuitnet,
Sept. 17, 2007.
"Black Pad - Though Rare, the Infamous and Irreparable PCB Defect Can Have
Disastrous Consequences," IPC Review, vol. 2 no. 2, pp. 5,
Mar./Apr. 2009.
"BMPCOE Strives to Mitigate Tin Whiskers," COTS Journal, vol.
xx no. xx, pp. 60-63, Sept. 2003.
"Boeing 601 (f.k.a. Hughes HS 601)."
"Boots pleads guilty to WEEE breaches," RTE Business, Jan.
24, 2006.
"Bridge-free Wave Soldering of Fine Pitch QFP," Tin World,
no. 12, pp. 16, Winter 2006.
"BT Task Force: BTTF 116-3 Title: Waste from electrical and electronic
equipment (WEEE)," CENELEC, Dec. 23, 2004.
"Building consensus," Electronics Supply & Manufacturing,
Feb. 2005.
"Building consensus," Green SupplyLine, Feb. 1, 2005.
"Bumps on Cu pillars tighten pitch," Solid State Technology, vol.
45 no. 11, pp. 24, Nov. 2002.
"Cadmium Plating," finishing.com.
"Cadmium Plating Prohibition," NASA Electronic Parts and Packaging
Program.
"Cadmium whiskers on Hubble," finishing.com.
"CAF," Electronics Manufacture and Test, vol. xx no. xx, pp.
xx-xx, June 7, 2002.
"California Expands RoHS Regulations," Conformity, 2007
Engineers' Reference Guide, pp. 222, 2007.
"California Goes the RoHS Way," Quality Digest, vol. 27 no. 4,
pp. 9, Apr. 2007.
"California Implements Battery Recycling Requirements," Conformity
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high-reliability applications," emsnow, July 5, 2006.
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evertiq, July 10, 2008.
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evertiq, 2006. Mar. 8,
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"Report - RoHS Request for more exemptions Dec 2004," Dec. 2004.
"Reports on Lead-Free Soldering Research Available," Conformity
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"Requested Exemption from the requirements of Article 4(1) of Directive
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"Research and Markets Announces Regulations Impacting Green Labelling,"
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"Research Updates on PCBs, RoHS, Economy, and PCs," SMT Web Exclusive
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"Researcher Develops New Electroplating Process That Gets the Lead Out of
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"Researchers Develop Environmentally Friendly Coatings for Military
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"Resistance Welding of Tin and Tin-Zinc Alloy Coated Mild Steel Sheet,"
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"Restriction of Hazardous Substances," EE Times - Asia, vol.
xx no. xx, pp. xx-xx, Dec. 3, 2004.
"Restriction of Hazardous Substances: Compliance Strategy Rev 2,"
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"Restriction of Hazardous Substances (RoHS) Directive 5 months to
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"Results from the Soldertec Global European Pb-Free Marking Survey," Jan.
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"Results of IPC Survey on REACH Preparedness in the North American and
European Electronic Interconnect Industry," IPC, July 2008.
"Results of National Electronic Distributor Association Meeting,"
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"Review of Directive 2002/95/EC (RoHS) Categories 8 and 9 - Stakeholder
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"Revised Directives," Appliance Design, vol. 57 no. 2, pp. 7-8,
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"Revised RoHS directives proposed," Electronics Manufacture and Test
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"Revision B of IPC-7095 Now Available," CircuiTree, vol. 21
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"Revolutionary methodology," Electronics Manufacture and Test
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"Rework - The Hidden Phenomenon?."
"Reworking BGAs/CSPs Using Lead-Free Solders," OK International.
"Reworking Pb-Free PCBs," Circuits Assembly, vol. 19 no. 10,
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"Risks of Conductive Whiskers in High-Reliability Electronics and Associated
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"RMD Instruments to Showcase A New Feature for LeadTracer-RoHS System at
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"RMD to Exhibit New Feature for LeadTracer-RoHS System at IPC Midwest,"
Circuitnet, Sept. 17, 2008.
"Road to RoHS," CircuiTree, vol. 18 no. 8, pp. xx-xx, Aug.
2005.
"Road to RoHS," CircuiTree, Sept. 1, 2005.
"Road to RoHS," CircuiTree, vol. 18 no. 9, pp. xx-xx, Sept.
2005.
"Road to RoHS," CircuiTree, vol. 18 no. 10, pp. xx-xx, Oct.
2005.
"Road to RoHS," CircuiTree, vol. 18 no. 11, pp. xx-xx, Nov.
2005.
"Road to RoHS," CircuiTree, vol. 18 no. 12, pp. xx-xx, Dec.
2005.
"Road to RoHS," CircuiTree, vol. 19 no. 1, pp. xx-xx, Jan.
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"Road to RoHS," CircuiTree, vol. 19 no. 2, pp. xx-xx, Feb.
2006.
"RoHS," EICTA, Sept. 15, 2004.
"RoHS Amendment: Commission Exempts DecaBDE and Lead in Bronze Bushings,"
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"RoHS and lead-free: how the regulations impact you," Dataweek
, vol. xx no. xx, pp. xx-xx, Oct. 4, 2006.
"RoHS and Material Declarations," Surface Mount Technology,
vol. xx no. xx, pp. xx-xx, xxx. xxxx
"RoHS and WEEE: could you be exempt?," Components in Electronics
, vol. xx no. xx, pp. xx-xx, Nov. 2005.
"RoHS and WEEE: Suppliers rattled to full compliance," Telecom
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"RoHS Assurance Tests To Support Materials Declarations," evertiq
, May 18, 2006.
"RoHS Brings Glee to Some and Gloom to Others in Taiwan Electronics Parts
Sector," CENS.com, Jan. 5, 2007.
"RoHS catalog released," Purchasing, vol. xx no. xx, pp.
xx-xx, Mar. 16, 2006.
"RoHS Challenges Business Practices Too," Embedded Technology,
pp. 2, 4, Mar. 2006.
"RoHS clarification at last," Components in Electronics, vol.
xx no. xx, pp. xx-xx, Aug. 2004.
"RoHS Compliance," ECN, vol. 50 no. 1, pp. 53, Jan. 2006.
"RoHS Compliance," Components in Electronics, vol. xx no. xx,
pp. xx-xx, Feb. 2006.
"RoHS compliance easier with JIG-101," evertiq, June 1, 2005.
"RoHS compliance for SMT and Through-hole equipment," Circuitnet
, May 29, 2006.
"RoHS compliance is about 25%," Purchasing, vol. 134 no. 7., pp.
20, Apr. 21, 2005.
"RoHS Compliance - No Quick Fix," PCB007, Feb. 9, 2006.
"RoHS compliance of assembly machine transferred to European facility,"
Circuitnet, June 11, 2006.
"RoHS compliance slow but steady in mainland China, Taiwan," Global
Sources, Jan. 8, 2007.
"RoHS compliance testing," EuroAsia Semiconductor, vol. xx
no. xx, pp. xx-xx, Aug. 2006.
"RoHS Compliance Testing Resource Now On-line at www.rohsbyxrf.com,"
PCB007, Aug. 15, 2005.
"RoHS compliant chips with their own marking," evertiq, July 21, 2005.
"ROHS Conformance -- Related Notes."
"RoHS could crimp connector supply," Purchasing, vol. xx no.
xx, pp. xx-xx, Mar. 30, 2006.
"RoHS deadline: Closer to ready," SourceESB, Dec. 14, 2005.
"RoHS Directive Compliance Procrastinators and Naysayers Take Heed," IPC
Review, pp. 16-17, Sept. 2005.
"RoHS Directive Doomed to Fail, Says Environmental Consultant,"
CircuiTree, vol. 19 no. 3, pp. xx-xx, Mar. 2006.
"RoHS Directives," (Dionics)
"RoHS - electronic products must display environmental protection stickers,"
emsnow, Feb. 28, 2007.
"RoHS Enforcement," Components in Electronics, vol. xx no.
xx, pp. xx-xx, Feb. 2006.
"RoHS Enforcement Still a Mystery, But Will Include Testing," Design
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"RoHS: European Commission Sets Official Limits," Conformity,
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"RoHS Exemption... A Blessing or A Curse?," Chip Scale Review,
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"RoHS exemption for agricultural equipment in Europe," Circuitnet
, Aug. 14, 2006.
"RoHS exemptions list available on the web," Electronics Weekly
, Aug. 21, 2006.
"RoHS exemptions situation becomes clearer," evertiq, Jan. 3,
2005.
"RoHS existing products vs. new products," Circuitnet, May 1,
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"RoHS Guidance Notes Reissued," Circuits Assembly, vol. 16 no. 3,
pp. 11, Oct. 2005.
"RoHS Guidance Re-issued," evertiq, Aug. 18, 2005.
"RoHS guidelines issued by UK enforcer," Electronics Weekly,
May 31, 2006.
"RoHS Hampers Product Innovation," SourceESB, June 29, 2006.
"RoHS impacts MRO parts," SourceESB, Nov. 16, 2005.
"RoHS in China delayed," evertiq, Jan. 11, 2006.
"RoHS: Is time running out for business to comply?," Apr. 22, 2005.
"RoHS isn't just inconvenient; it's potentially deadly," EE Times
, Oct. 9, 2006.
"RoHS: It's all still happening," Electronics News, Sept. 3,
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"RoHS Law for US? Newark InOne Poll Says 'Yes' 2 to 1," PCB007
, Dec. 21, 2006.
"RoHS less rosy from across the pond," Electronics Manufacture and
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"RoHS: Most suppliers to change part numbers," Purchasing,
vol. xx no. xx, pp. xx-xx, Nov. 29, 2005.
"RoHS panel discussion," EngineerIT, vol. xx no. xx, pp.
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"RoHS Part Numbering: The Continuing Saga," Design News, vol.
60 no. 8, pp. xx, June 6, 2005.
"RoHS PCB Specification - What Has To Change?," evertiq, Dec.
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"RoHS PCB specification - what has to change?," Soldering &
Surface Mount Technology, vol. 19 no. 1, pp. xx-xx, 2007.
"RoHS - perspectives of a PWB manufacturer," IPC Brussels,
Brussels, Belgium, June 18, 2008, pp. xx-xx.
"RoHS poll stirs debate," Purchasing, vol. xx no. xx, pp.
xx-xx, Nov. 2, 2006.
"RoHS, REACH and You," IPC Review, vol. 1 no. 1, pp. 11,
Mar./Apr. 2008.
"RoHS Readiness," Sanmina-Sci, June 2004.
"RoHS Regs are the Start - Not the "End-game"," Printed Circuit Design
and Manufacture, vol. 24 no. 2, pp. insert, Feb. 2007.
"RoHS remains a burning issue," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, May 19, 2008.
"RoHS Revisited," Application Reference Materials, pp.
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"RoHS Revisited," Electronic Products, July 2008.
"RoHS Routes to Compliance," SMART/LEADOUT Lead-Free Implementation
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"RoHS Scope Are you in or out?,"
"RoHS screening service announced," evertiq, Mar. 3, 2005.
"RoHS: "Stakeholders" Plead Their Cases for Exemption," Conformity
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"RoHS substances (Hg, Pb, Cr(VI), Cd, PBB and pBDE) in electrical and
electronic equipment in Belgium (Final Report)," Federal Public Service
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"RoHS Support Service Established," PCB007, Aug. 28, 2006.
"RoHS: the good, the bad and the ugly," Dataweek, vol. xx no.
xx, pp. xx-xx, Apr. 6, 2005.
"RoHS: the good, the bad and the ugly," Electronicstalk,
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"RoHS: Third-Party Certification," CircuiTree, vol. 19 no. 4,
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"RoHS: Time Running Out to Prepare," Manufacturing Engineer, vol.
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"RoHS to obsolete entire catalogues overnight," Dataweek,
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"RoHS Transition Should be a Company-Wide Concern," Lead-Free
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"RoHS Troubles Affect Taiwan Industry," Surface Mount Technology Online,
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"RoHS uncertainties - is there a light at the end of the tunnel?,"
Components in Electronics, vol. xx no. xx, pp. xx-xx, Nov. 2006.
"RoHS Under Fire for Weak Science," Design News, vol. 61 no.
13, pp. 30, Sept. 25, 2006.
"RoHS Under Review: IPC Urges Commission to Aim for Science-based
Regulations with Thorough Consideration of Life Cycle Impacts,"
PCB007, Jan. 21, 2008.
"RoHS under review - IPC urges commission to aim for science-based regulations
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Jan. 22, 2008.
"RoHS Under Review: IPC Urges Commission to Aim for Science-based Regulations
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"Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of
Tin, Silver and Copper: Final Report,", IPC Solder Products Value Council.
"Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of
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"RS trusts in Fischer," Finishing, vol. 30 no. 2, pp. 26,
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"Rushing out RoHS help - part one: distribution," SourceESB, Jan. 25,
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"RUWEL AG Offers Numerous Lead-free Alternatives for Circuit Boards,"
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"Ruwel says advancing on 'green circuit board'," PCB007, Aug.
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"Same Parts, New Numbers?," Electrospec, vol. xx no. xx, pp.
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"Satellite Failure Will Hurt Channel One's Second-Quarter Results,"
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"Scientists Research Tin Pest and Whiskers," SMT Web Exclusive Article.
"Scope of UL PCB Silver Task Group," PCB007, Oct. 9, 2006.
"Schwarzenegger Terminates State RoHS Bill," Printed Circuit Design and
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"Schwarzennegger Vetoes AB 48," IPC Review, vol. 48 no. 9, pp. 7,
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"Second ECTC iNEMI Tin Whisker Workshop," Components, Packaging, and
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June 2005.
"Second European Lead-Free Soldering Technology Roadmap," Soldertec, Feb.
2003.
"Secondary Reflow of Lead-Free Joints," Electronics Manufacture and
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"Selective Finishing: Stannatech The Unique Immersion Tin Process,"
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"Self-Declaration of conformance (Example) Version 1,"
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"SEMI Regulatory Alert on "China RoHS"," SEMI, Oct. 3, 2006.
"SEMI warns members to take action on China RoHS," Global Sources
, Nov. 14, 2006.
"Separate wash systems for leaded and non-lead boards?," Circuitnet
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"Set of recommendations to help reduce risk of Tin Whiskers,"
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"Set up for lead-free wave soldering," Circuitnet, Feb. 9,
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"Seven questions to ask your board maker on RoHS," Green SupplyLine
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"Seven Substances Recommended for Inclusion in REACH Authorization List,"
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"Shaving the whiskers for lead-free production," European
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"Shea Keynote Looks Ahead," SMT Web Exclusive Article.
"Shelf-Life Evaluation of Nickel/Palladium Lead Finish for Integrated
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"Should the U.S. employ RoHS-like standards for imported products?,"
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"Since we build to customer spec are we safe from Material Declaration ...,"
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"Sitzung vom 25. October," Berichte der Deutschen Chemischen
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"Six RoHS Exemptions Added," SMT Web Exclusive Article.
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"SMART Group unveils 'Lead-free Experience 4' report," Tin World
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"Sn-Ag-Cu: key to a lead-free Europe_and world," Control Engineering
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"Sn-plating in respect to proposed Nemi test conditions," Oct. 29, 2004.
"SN100C Celebrates a Remarkable Milestone," Surface Mount Technology
(SMT), vol. 23 no. 1, pp. 4-5, Jan.-Feb. 2009.
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vol. xx no. xx, pp. xx-xx, Feb. 2005.
"Solder costs still soaring," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, Apr. 18, 2007.
"Solder leveled - Hot Air Solder Leveled (HASL)," Electronics
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"Solderable Finishes," Electronics Manufacture and Test, vol.
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"Solderability of Tin-Coated Copper," Plating, vol. 52 no. 4, pp.
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"Solderability Tests," ST Microelectronics Application Note AN2036, Nov.
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"Soldering Compatibility (Backward and Forward)," ST Application Note
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"Soldering On," Electronics Times, vol. xx no. xx, pp. xx-xx,
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"Soldering Resistance and Moisture Sensitivity Level (MSL) Classification of
STMicroelectronics Lead-Free Devices," ST Microelectronics Application
Note AN2033, Nov. 2004.
"Soldering tips for the 'lead-free' process," Dataweek, vol.
xx no. xx, pp. xx-xx, July 26, 2006.
"Solders come to attention," Environmental Engineering, vol. 13
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"Solders in Electronics: A Life-Cycle Assessment Summary," United States
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"Solectron Hosts Environmental Compliance Roundtable," PCB007
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"Solectron Reaches RoHS Goals," Electronic News, Dec. 5,
2005.
"Solutions - and complications - emerge for RoHS directive,"
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"Some electronics OEMs design out bromine, chlorine from products,"
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no. xx, pp. xx-xx, Sept. 20, 2006.
"Sony to recycle electronics for free," Electronics Manufacture and
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"SPECIFICATIONS To Invitation to Tender DG ENV.G.4/ETU/2006/xxxx."
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"Speedline Completes Study on Lead-free Process Optimization,"
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"Speedline Technologies Launches Web Site as Resource on Lead-Free SMT
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"Spotlight on Pb-free alternatives," Electronics Manufacture and
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"Stakeholder Consultation on Adaptation to Scientific and Technical Progress
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"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The first consultation period ended July 5, 2004.)
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The second consultation period ended Feb. 11, 2005.)
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The third consultation period ended Oct. 28, 2005.)
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The fourth consultation period ended Feb. 10, 2006.)
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The fifth consultation period ended May 15, 2006.)
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The sixth consultation period ended Jan. 10, 2007.)
"Standard Addresses Environmental Issues with Computers," Nuts and Volts
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"Standard Released for Worse Case Thermal Limits," Surface Mount
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"Standards for Compliance Documentation," Design News, vol.
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"Steady As It Goes: IPC Hosts Executive Market and Technology Forum in
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"Step-by-Step Guide to Compliance with the RoHS Directive."
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"Subject: Impact of REACH on downstream users," AeA, ceced, EICTA, EECA
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"Supply change management key to RoHS compliance," Electronics
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"Surface Finish Options," Data Circuit Systems, May 2002.
"Surface Finish Options," Merix, Aug 2002.
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"Survey Response Tools Ver. 3 Operation Manual, Second Edition," Japan
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"Survey Shows Europe Mostly Ready for RoHS," Design News,
vol. 61 no. 6, pp. xx, Apr. 24, 2006.
"Survey shows skepticism on national E-waste agreement," Connector
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"Switch makers deal with RoHS," Purchasing, vol. xx no. xx,
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"Taiwanese IT Manufacturers Detected Not Compliant With RoHS,"
Taiwan Economic News, Aug. 22, 2006.
"Taiwanese LCD-TV Suppliers Make Themselves RoHS Compliant,"
CENS.com, July 31, 2006.
"Taiwanese Manufacturers Move to Comply With EuP Directive,"
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"Taiwanese Tool Makers Turn to Eco-Friendly Products to Meet RoHS
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"Taiwan`s IT and Electronics Industries Go Green," CENS.com,
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"Taiwan`s Production of Electronic Components To Grow 9% in 2005,"
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"Taiwan`s Production of Electronic Components To Grow 9% in 2005,"
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"Tech Tips... Identifying Counerfeit Components," empfasis,
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"Tech Tips... Implementing Lead-Free Soldering," empfasis,
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"Technic Announces Surface Oxidation Reduction Patent," CircuiTree
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"Texas Instruments' RoHS 'Gold' Aids Customers in RoHS Transition,"
CircuiTree, vol. 18 no. 8, pp. xx-xx, Aug. 2005.
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Alam, M. O., Chan, Y. C., and Hung, K. C.,
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Pad During Reflow Soldering in Microelectronic Packaging," 2002
Proceedings 52nd Electronic Components & Technology Conference, San
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Alam, M. O., Lu, H., Bailey, Chris, Wu, B. Y., and Chan, Y. C.,
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the Electroless Ni-P Metallization for BGA Solder Joints Application,"
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Albert, F.,and Schmidt, M.,
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"Advanced Packages and Board Level Reliability," 1st Electronics
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Albrecht, H.-J., Walter, H., and Lantzsch, M.,
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2003 SMTA International Conference Proceedings, Chicago, IL,
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Albrecht, H.-J.,
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2000, pp. xx-xx.
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SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26,
2002, pp. xx-xx.
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and Area Array Components," 2001 SMTA International Conference
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Albrecht, H.-J., Heimann, M., Gotze, Ch., and Loffler, M.,
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"Interface Description and Failure Mechanism of SnAgCu Solders in BGA
Packages," 2004 SMTA International Conference Proceedings,
Chicago, IL, Sept. 26-30, 2004, pp. 309-313.
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"Lead-Free Solder Alloy Optimization for Improved Reliability," 2006
SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28,
2006, pp. 126-133.
Albrecht, H.-J.,
"Lead-Free Solder Joints and Failure Mechanism on Different Finishes,"
2005 SMTA International Conference Proceedings, Chicago, IL, Sept.
25-29, 2005, pp. 584-590.
Albrecht, H.-J., Fruhauf, P., and Wilke, K.,
"Pb-Free Alloy Alternatives: Reliability Investigation," SMTA
International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 308-316.
Albrecht, Hans-Jurgen, and Wilke, Klaus,
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1st Electronics Systemintegration Technology Conference, Volume 1
, Dresden, GermAAAA
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